Coupled molecular dynamics/continuum simulations of Joule heating and melting of isolated copper-aluminum asperity contacts

Engineering

• Dislocation Emission 100%
• Nanometre 50%
• Constant Voltage 50%
• Computer Simulation 50%
• Numerical Solution 50%
• Contact Area 50%
• Current Flow 50%
• Heat Transport 50%
• Copper Substrate 50%
• Voltage Drop 50%
• Resistor Network 50%
• Aluminum Substrate 50%

Material Science

• Contact Area 100%
• Solid Interface 100%