TY - GEN
T1 - Effect of displacement rate on lap shear test of SAC solder ball joints
AU - Wang, X. J.
AU - Wang, Z. G.
AU - Shang, J. K.
PY - 2008
Y1 - 2008
N2 - Lap-shear tests were combined with elastic-viscoplastic constitutive modeling to study the shear behavior of Sn3.8Ag0.7Cu (SAC) solder ball joints. In the shear rate range of 0.005mm/s to 0.7mm/s, the peak shear force was attained an optimal rate (labeled as vo), around 0.3mm/s. On either side of vo, the shear fracture behavior was quite different. Cross-section examinations of the remaining solder joints after fracture showed that the fracture surface moved towards the solder/IMC interface with an increasing shear rate. Two shear modes were evident: below vo, a cohesive shear fracture controlled by the solder properties and above v o, solder/IMC interface controlled fracture.
AB - Lap-shear tests were combined with elastic-viscoplastic constitutive modeling to study the shear behavior of Sn3.8Ag0.7Cu (SAC) solder ball joints. In the shear rate range of 0.005mm/s to 0.7mm/s, the peak shear force was attained an optimal rate (labeled as vo), around 0.3mm/s. On either side of vo, the shear fracture behavior was quite different. Cross-section examinations of the remaining solder joints after fracture showed that the fracture surface moved towards the solder/IMC interface with an increasing shear rate. Two shear modes were evident: below vo, a cohesive shear fracture controlled by the solder properties and above v o, solder/IMC interface controlled fracture.
UR - http://www.scopus.com/inward/record.url?scp=52449084997&partnerID=8YFLogxK
U2 - 10.1109/ICEPT.2008.4607118
DO - 10.1109/ICEPT.2008.4607118
M3 - Conference article
AN - SCOPUS:52449084997
SN - 9781424427406
T3 - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
BT - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
T2 - 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Y2 - 28 July 2008 through 31 July 2008
ER -