TY - GEN
T1 - MetaHap
T2 - 6th IFIP International Conference on Internet of Things, IFIP IoT 2023
AU - Sibi Chakkaravarthy, S.
AU - John, Marvel M.
AU - Vimal Cruz, Meenalosini
AU - Arun Kumar, R.
AU - Anitha, S.
AU - Karthikeyan, S.
N1 - Publisher Copyright:
© 2024, IFIP International Federation for Information Processing.
PY - 2024
Y1 - 2024
N2 - This paper presents the design and development of a low cost haptic glove equipped with a range of affordable sensors, including gyroscopes, accelerometers, GPS, servos, and encoders, for use in metaverse environments. The primary focus of this research is to create an immersive and interactiveVirtual Reality (VR) experience by incorporating haptic feedback into the glove. This research provides a detailed overview of the glove’s design and construction, highlighting the integration of Arduino micro-controllers with the various sensors and actuators. The techniques employed to ensure accurate and synchronized data capture are also discussed. Furthermore, the haptic feedback system integrated into the glove is thoroughly explained, including the mechanisms for generating the haptic feed back, which will allow the user to determine the shape and size of the objects in the virtual environment. By utilizing the servos and encoders, the glove can provide users with a tactile experience by simulating the sensation of touching virtual objects or environments. The potential applications of the haptic glove in gaming, virtual training, and medical simulations are explored, emphasizing the benefits of incorporating haptic feedback for enhanced user immersion and engagement. The glove’s versatility and affordability make it a viable solution for a wide range of VR applications. In conclusion, this research presents an Small Board Computer (SBC) - based haptic glove that combines affordable sensors with haptic feedback capabilities, providing users with an immersive and tactile VR experience. The findings contribute to the advancement of VR technology, particularly in the field of haptic interfaces, and open avenues for further exploration and customization of haptic glove applications.
AB - This paper presents the design and development of a low cost haptic glove equipped with a range of affordable sensors, including gyroscopes, accelerometers, GPS, servos, and encoders, for use in metaverse environments. The primary focus of this research is to create an immersive and interactiveVirtual Reality (VR) experience by incorporating haptic feedback into the glove. This research provides a detailed overview of the glove’s design and construction, highlighting the integration of Arduino micro-controllers with the various sensors and actuators. The techniques employed to ensure accurate and synchronized data capture are also discussed. Furthermore, the haptic feedback system integrated into the glove is thoroughly explained, including the mechanisms for generating the haptic feed back, which will allow the user to determine the shape and size of the objects in the virtual environment. By utilizing the servos and encoders, the glove can provide users with a tactile experience by simulating the sensation of touching virtual objects or environments. The potential applications of the haptic glove in gaming, virtual training, and medical simulations are explored, emphasizing the benefits of incorporating haptic feedback for enhanced user immersion and engagement. The glove’s versatility and affordability make it a viable solution for a wide range of VR applications. In conclusion, this research presents an Small Board Computer (SBC) - based haptic glove that combines affordable sensors with haptic feedback capabilities, providing users with an immersive and tactile VR experience. The findings contribute to the advancement of VR technology, particularly in the field of haptic interfaces, and open avenues for further exploration and customization of haptic glove applications.
KW - Glove
KW - Haptic Glove
KW - Metaverse
KW - Reality portal
KW - Virtual Reality
UR - http://www.scopus.com/inward/record.url?scp=85177236543&partnerID=8YFLogxK
U2 - 10.1007/978-3-031-45878-1_25
DO - 10.1007/978-3-031-45878-1_25
M3 - Conference article
AN - SCOPUS:85177236543
SN - 9783031458774
T3 - IFIP Advances in Information and Communication Technology
SP - 362
EP - 372
BT - Internet of Things. Advances in Information and Communication Technology - 6th IFIP International Cross-Domain Conference, IFIPIoT 2023, Proceedings
A2 - Puthal, Deepak
A2 - Mohanty, Saraju
A2 - Choi, Baek-Young
PB - Springer Science and Business Media Deutschland GmbH
Y2 - 2 November 2023 through 3 November 2023
ER -