Multiscale modeling of metal-metal contact dynamics under high electromagnetic stress: Timescales and mechanisms for joule melting of Al-Cu asperities

Douglas Irving, Clifford Padgett, Yin Guo, John Mintmire, Donald Brenner

Research output: Contribution to book or proceedingConference articlepeer-review

Abstract

An analysis and initial results from a multiscale continuum-atomistic simulation of the Joule heating and melting of Cu-Al asperity contacts is presented. An analytic expression is given for the time needed to reach the Al melting point for an asperity as a function of the voltage drop and the asperity contact area. The coupled continuum-atomistic simulations capture the initial stages of the formation of Al-Cu alloys that arises from the solvation of Cu atoms into the Al melt. Implications of these results for understanding contacts in electromagnetic launchers are discussed.

Original languageEnglish
Title of host publication2008 14th Symposium on Electromagnetic Launch Technology, EML, Proceedings
Pages269-274
Number of pages6
DOIs
StatePublished - 2008
Event2008 14th Symposium on Electromagnetic Launch Technology, EML - Victoria, BC, Canada
Duration: Jun 10 2008Jun 13 2008

Publication series

Name2008 14th Symposium on Electromagnetic Launch Technology, EML, Proceedings

Conference

Conference2008 14th Symposium on Electromagnetic Launch Technology, EML
Country/TerritoryCanada
CityVictoria, BC
Period06/10/0806/13/08

Keywords

  • Asperity
  • Joule heating
  • Molecular dynamics simulations
  • Multiscale modeling

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