Multiscale modeling of metal-metal contact dynamics under high electromagnetic stress: Timescales and mechanisms for Joule melting of Al-Cu asperities

Douglas L. Irving, Clifford W. Padgett, Yin Guo, John W. Mintmire, Donald W. Brenner

Research output: Contribution to journalArticlepeer-review

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Abstract

An analysis and initial results from a multiscale continuum-atomistic simulation of the Joule heating and melting of Cu-Al asperity contacts are presented. An analytic expression is given for the time needed to reach the Al melting point for an asperity as a function of the voltage drop and the asperity contact area. The coupled continuum-atomistic simulations capture the initial stages of the formation of Al-Cu alloys, which arises from the sol vation of Cu atoms into the Al melt. The implications of these results for understanding contacts in electromagnetic launchers are discussed.

Original languageEnglish
Article number4773546
Pages (from-to)331-335
Number of pages5
JournalIEEE Transactions on Magnetics
Volume45
Issue number1
DOIs
StatePublished - Jan 2009

Keywords

  • Asperity
  • Joule heating
  • Molecular dynamics simulations
  • Multiscale modeling

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